Data Design Advances Assembly Technology To Handle 0.4mm Pitch Chip Scale Packages With Package On Package Configurations

Part of the value of electronic development work completed at Data Design is the ability to assemble prototypes in house quickly and cost effectively.  The latest technology steps in components offer smaller size, weight, and power (SWAP) features to drive industry break through items such as cell phones and pocket media players.  Keeping pace with the industry in printed wiring board design and assembly techniques allows Data Design to offer customers the same level of technology density for unique applications.  Keeping with this tradition, Data Design is now working with the Texas Instruments Open Multimedia Application Platform (OMAP) processor in chip scale packaging (CSP).  These devices pack substantial processor resources into a 12mm square package requiring 0.4mm component lead spacing in a high density, highly flexible package incorporating the memory components as a second chip scale package mounted on top of the processor in a package on package (POP) configuration.