Advanced Electronic Assembly

Data Design maintains a model shop with state of the art surface mount assembly equipment capable of producing electronic assemblies using the most advanced component parts. Seamless integration of design data, materials management, assembly, inspection, and test make the model shop cost effective and ultra fast in completion of prototype and short run production requirements.

Assembly, inspection, and modification equipment is available to work with ball grid array (BGA), chip scale package (CSP), and miniature passive components such as 0201 packages, as well as more common components. Advanced CAD tools provide the ability to design and assemble multilayer boards with 0.003 inch line and space and 0.4mm component lead pitch with blind and buried vias when necessary. However, with these techniques being relatively expensive, Data Design's skilled designers will always work to provide the most cost effective board design possible for an application. Fluid working relationships with component vendors, materials vendors, and bare board manufacturers at all technology levels provides for fast and effective results.

These sophisticated engineering support tools complete the circle of unparalleled vertical integration for custom electronic design and manufacturing. The ability to design and build custom electronics assemblies often provides the ability to match or improve upon the cost profile of a system using off the shelf items while greatly improving the ability to optimize performance.